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KING BILLION ELECTRONICS CO., LTD
HE83138
HE80000 SERIES
A. HE83138 Introduction
HE83138 is a member of 8-bit Micro-controller series developed by King Billion Electronics Ltd. This IC provides 512 pixels LCD display and built-in OP comparator can be used with light, voice, temperature and humility sensor or used to detect the battery low. The 7-bit current-type D/A converter and PWM drive output provide the complete speech output mechanism. The 48K bytes ROM size can be used to store 15 seconds speech data. It can be applicable to the LCD game, medium level educational toy, lower second voice recording system or used with external command mode SRAM or Flash RAM for higher second voice recording etc. The instruction sets of HE80000 series are quite easy to learn and simple to use. Only about thirty instructions with four-type addressing mode are provided. Most of instructions take only 3 oscillator clocks (machine cycles). The performance of HE83750S is enough for most of battery operation system.
B. HE83138 Features
Operation Voltage: System Clock Clock Source: Dual Clock System 2.4V ~ 5.5V 4MHz ~ 8MHz Internal/External Fast clock, Internal/External slow clock Normal (Fast) clock 32.768KHz ~ 8MHz Slow clock 32.768 KHz DUALFASTSLOWIDLESLEEP Mode. 48K Bytes. 1K Bytes.
Operation Mode Internal ROM: Internal RAM: Watch dog timer. 16 Bi-directional I/O ports. 512 pixels LCD driver with A, B type choice LCD Bias : 1/5 LCD Charge Pump: 1 or 1.5 times of VDD One 7-bits current-type DAC output. One built-in OP comparator. PWM device. Built-in DTMF Generator. Speech recognition function Two external interrupts and three internal timer interrupts. Two 16-bit timers. Instruction set 32 instructions, 4 addressing mode. 10-bit DATA POINTER for RAM and 16-bit TABLE POINTER for ROM.
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KING BILLION ELECTRONICS CO., LTD
HE83138
HE80000 SERIES
C. Pin Description
Pin # Pin name
78 77 FXI, FXO
I/O
Function
Description
81 80
SXI, SXO
76
RSTP_N
External fast clock input/output Mask Option setting: B, pins are used to connect crystal or MO_FCK/SCKN= 00 : Slow Clock only O RC to generate the 32.768KHz ~ 01 : Illegal 8MHz system clock. 10Dual Clock 11Fast Clock only MO_FOSCE= 0Internal fast clock 1External fast clock External slow clock input/output MO_FXTAL= 0R,C OSC. for Fast Clock pins used to connect the 1Crystal OSC. for Fast Clock I, 32.768KHz crystal to generate MO_SXTAL= 0R,C OSC. for 32.768K Clock O slow clock for system operation 1 Crystal OSC. for 32.768K Clock (slow mode), LCD display or Use OP1 and OP2 to switch among different timer 1 clock source. operation mode (NORMAL, SLOW, IDEL and SLEEP). In Dual Clock mode, the main system clock is still the Fast Clock. The 32768 Hz clock is for LCD and Timer 1 only. Active low and level trigger reset signal. User can also set the mask option MO_PORE=1 to enable the build-in Power-on reset circuit besides using the reset pin. I System reset signal Watch Dog Timer can also be enabled/disabled by the mask option, MO_WDTE = 0Disable Watch Dog Timer = 1Enable Watch Dog Timer I IC Test Pin No Connection Pin Bi-directional I/O port D. PRTD B [7:2] also used as wake-up pin, and PRTD [7:6] also used as external interrupt pin. Mask options setting: MO_DPP [7:0] = 1Push-pull output. = 0Open-drain output. Output must be "1" before reading whenever uses them as input (Non tri-state structure). Mask options setting: MO_17PP [7:0] = 1Push-pull output. = 0Open-drain output. Output must be "1" before reading whenever uses them as input (Non tri-state structure). LCD common/segment driving pins. LCD Data filled from 80H; please refer the LCD RAM map. When LV3=VDD, the charge pump for LCD is turn off. The capacitor between LC1 and LC2 shall be removed to reduce power consumption. Refer to application circuit.
79 91,92, 93,1
TSTP_P NC
Please bond this pin to ground by a 0 ohm resistor to let it accessible when it's necessary for some testing.
83:90 PRTD[7:0]
12..19 PRT17[7:0] B Bi-directional I/O port 17
11..4 COM[15:0] O LCD COM Output 52..59 20..51 SEG[31:0] 61 60 63 62 LC2 LC1 LV3 LV1 O LCD SEG Output B Charge Pump Switch 1 B Charge Pump Switch 2 B Charge Pump V3 B Charge Pump V1
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KING BILLION ELECTRONICS CO., LTD Pin # Pin name
64..68 69 2 3 71 72 73 74 75 82 70 LR[4:0] LVG PWMP PWMN VO DAO OPIN OPIP OPO VDD GND
HE83138
HE80000 SERIES
I/O
Function
Description
B LCD Resister level 4 ~ 0 Refer to application circuit. I LCD Virtual Ground Refer to application circuit. The PWM positive output can O drive speaker or buzzer directly. Set the bit2(PWM=1) of VOC register and bit0 of The PWM positive output can PWMC register to turn on PWM O drive speaker or buzzer directly. O Set the bit0(OP=0) and bit1(DA=1) of VOC Voice output. O I I O P P DAC Output OPAMP negative input pin. OPAMP positive input pin. OPAMP output pin. Positive Power Input Power Ground Input
register to turn on VO Set the bit0(OP=1) and bit1(DA=1) of VOC register to turn on DAO Enable DAO to work with OP. Refer to application note for detailed operation.
Adding a 0.1 F capacitor as by-pass capacitor between VDD and GND.
Built-in OP comparator.
D. LCD RAM MAP
Page 0 COM0 COM1 COM2 : : COM13 COM14 COM15 SEG [7:0] 80H 81H 82H : : 8DH 8EH 8FH SEG [15:8] 90H 91H 92H : : 9DH 9EH 9FH SEG [23:16] A0H A1H A2H : : ADH AEH AFH SEG [31:24] B0H B1H B2H : : BDH BEH BFH
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KING BILLION ELECTRONICS CO., LTD
HE83138
HE80000 SERIES
E. Pin Diagram
P R T D [0] P R T D [1] P R T D [2] P R T D [3] P R T D [4] P R T D [5] P R T D [6] P R TVSS DDXX [7] D I O T S T P | P R S T O FFPOP XX| PI IONOP O P I N
NN N CC C
D A O VO GND
NC PWMP PWMN COM[8] COM[9] COM[10] COM[11] COM[12] COM[13] COM[14] COM[15] PRT17[7] PRT17[6] PRT17[5] PRT17[4] PRT17[3] PRT17[2] PRT17[1] PRT17[0] SEG[31] SEG[30] SEG[29] SEG[28] SEG[27]
LVG LR0 LR1 LR2 LR3 LR4 LV3 LV1
Die Size: 3100 m * 3240 m Substrate connect with GND
LC2 LC1 COM[0] COM[1] COM[2] COM[3] COM[4] COM[5] COM[6] COM[7] SEG[0] SEG[1] SEG[2] SEG[3] SEG[4]
Product name
SEG[5]
S E G [2 6]
S E G [2 5]
S E G [2 4]
S E G [2 3]
S E G [2 2]
S E G [2 1]
S E G [2 0]
S E G [1 9]
S E G [1 8]
S E G [1 7]
S E G [1 6]
S E G [1 5]
S E G [1 4]
S E G [1 3]
S E G [1 2]
S E G [1 1]
S E G [1 0]
S E G [9]
S E G [8]
S E G [7]
S E G [6]
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KING BILLION ELECTRONICS CO., LTD
HE83138
HE80000 SERIES
F. Bonding Pad Location
PIN PIN X Y PIN PIN X Y Number Name Coordinate Coordinate Number Name Coordinate Coordinate 1 NC X= -1475.80 Y= 1246.95 48 SEG[3] X= 1474.30 Y= -1236.15 2 PWMP X= -1475.80 Y= 1107.20 49 SEG[2] X= 1474.30 Y= -1120.65 3 PWMN X= -1475.80 Y= 943.85 50 SEG[1] X= 1474.30 Y= -1005.15 4 COM[8] X= -1475.80 Y= 804.75 51 SEG[0] X= 1474.30 Y= -889.65 5 COM[9] X= -1475.80 Y= 689.25 52 COM[7] X= 1474.30 Y= -774.15 6 COM[10] X= -1475.80 Y= 573.75 53 COM[6] X= 1474.30 Y= -658.65 7 COM[11] X= -1475.80 Y= 458.25 54 COM[5] X= 1474.30 Y= -543.15 8 COM[12] X= -1475.80 Y= 342.75 55 COM[4] X= 1474.30 Y= -427.65 9 COM[13] X= -1475.80 Y= 227.25 56 COM[3] X= 1474.30 Y= -312.15 10 COM[14] X= -1475.80 Y= 111.75 57 COM[2] X= 1474.30 Y= -196.65 11 COM[15] X= -1475.80 Y= -3.75 58 COM[1] X= 1474.30 Y= -81.15 12 PRT17[7] X= -1475.80 Y= -119.25 59 COM[0] X= 1474.30 Y= 34.35 13 PRT17[6] X= -1475.80 Y= -234.75 60 LC1 X= 1474.30 Y= 149.85 14 PRT17[5] X= -1475.80 Y= -350.25 61 LC2 X= 1474.30 Y= 265.35 15 PRT17[4] X= -1475.80 Y= -465.75 62 LV1 X= 1474.30 Y= 380.85 16 PRT17[3] X= -1475.80 Y= -581.25 63 LV3 X= 1474.30 Y= 496.35 17 PRT17[2] X= -1475.80 Y= -696.75 64 LR4 X= 1474.30 Y= 611.85 18 PRT17[1] X= -1475.80 Y= -812.25 65 LR3 X= 1474.30 Y= 727.35 19 PRT17[0] X= -1475.80 Y= -927.75 66 LR2 X= 1474.30 Y= 842.85 20 SEG[31] X= -1475.80 Y= -1043.25 67 LR1 X= 1474.30 Y= 958.35 21 SEG[30] X= -1475.80 Y= -1158.75 68 LR0 X= 1474.30 Y= 1073.85 22 SEG[29] X= -1475.80 Y= -1274.25 69 LVG X= 1474.30 Y= 1189.35 23 SEG[28] X= -1475.80 Y= -1389.75 70 GND X= 1474.30 Y= 1304.85 24 SEG[27] X= -1475.80 Y= -1505.25 71 VO X= 1474.30 Y= 1438.50 25 SEG[26] X= -1155.05 Y= -1541.50 72 DAO X= 1124.45 Y= 1539.10 26 SEG[25] X= -1039.55 Y= -1541.50 73 OPIN X= 990.80 Y= 1539.10 27 SEG[24] X= -924.05 Y= -1541.50 74 OPIP X= 875.30 Y= 1539.10 28 SEG[23] X= -808.55 Y= -1541.50 75 OPO X= 759.80 Y= 1539.10 29 SEG[22] X= -693.05 Y= -1541.50 76 RSTP_N X= 644.30 Y= 1539.10 30 SEG[21] X= -577.55 Y= -1541.50 77 FXO X= 528.80 Y= 1539.10 31 SEG[20] X= -462.05 Y= -1541.50 78 FXI X= 413.30 Y= 1539.10 32 SEG[19] X= -346.55 Y= -1541.50 79 TSTP_P X= 297.80 Y= 1539.10 33 SEG[18] X= -231.05 Y= -1541.50 80 SXO X= 182.30 Y= 1539.10 34 SEG[17] X= -115.55 Y= -1541.50 81 SXI X= 66.80 Y= 1539.10 35 SEG[16] X= -0.05 Y= -1541.50 82 VDD X= -48.70 Y= 1539.10 36 SEG[15] X= 115.45 Y= -1541.50 83 PRTD[7] X= -164.20 Y= 1539.10 37 SEG[14] X= 230.95 Y= -1541.50 84 PRTD[6] X= -279.70 Y= 1539.10 38 SEG[13] X= 346.45 Y= -1541.50 85 PRTD[5] X= -395.20 Y= 1539.10 39 SEG[12] X= 461.95 Y= -1541.50 86 PRTD[4] X= -510.70 Y= 1539.10 40 SEG[11] X= 577.45 Y= -1541.50 87 PRTD[3] X= -626.20 Y= 1539.10 41 SEG[10] X= 692.95 Y= -1541.50 88 PRTD[2] X= -741.70 Y= 1539.10 42 SEG[9] X= 808.45 Y= -1541.50 89 PRTD[1] X= -857.20 Y= 1539.10 43 SEG[8] X= 923.95 Y= -1541.50 90 PRTD[0] X= -972.70 Y= 1539.10
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KING BILLION ELECTRONICS CO., LTD PIN PIN Number Name 44 SEG[7] 45 SEG[6] 46 SEG[5] 47 SEG[4]
HE83138
HE80000 SERIES
X Y PIN PIN X Y Coordinate Coordinate Number Name Coordinate Coordinate X= 1039.45 Y= -1541.50 91 NC X= -1088.20 Y= 1539.10 X= 1154.95 Y= -1541.50 92 NC X= -1203.70 Y= 1539.10 X= 1474.30 Y= -1467.15 93 NC X= -1319.20 Y= 1539.10 X= 1474.30 Y= -1351.65
G. DC/AC Characteristics
Absolute Maximum Rating
Item Supply Voltage Input Voltage Output Voltage Operating Temperature Storage Temperature Sym. Rating Vdd -0.5V ~ 8V Vin -0.5V ~ Vdd+0.5V Vo -0.5V ~ Vdd+0.5V Top 00C ~ 700C Tst -500C ~ 1000C Condition
Recommended Operating Conditions
Item Supply Voltage Input Voltage Operating Frequency Operating Temperature Storage Temperature Sym. Rating Vdd 2.4V ~ 5.5V Vih 0.9 Vdd ~ Vdd 0.0V ~ 0.1Vdd Vil Fmax 8MHz 4MHz 0 Top 0 C ~ 700C Tst -500C ~ 1000C Condition
Vdd =5.0V Vdd =2.4V
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KING BILLION ELECTRONICS CO., LTD
HE83138
HE80000 SERIES
Testing condition : TEMP=25, VDD=3V+/-10%, GND=0V PARAMETER CONDITION MIN TYP MAX UNIT NORMAL Mode Current System 2M ext. R/C 0.75 1 mA IFast 32.768K X'tal System A ISlow SLOW Mode Current 10 20 LCD Disable 32.769K X'tal IDLE Mode Current System A IIdle 6 10 LCD Disable LCD Enable, LCD option=300Kohm 12 20 Extra Current if LCD Voltage-doubler OFF A System ILCD ON LCD Enable, LCD option=30Kohm, 100 120 Voltage-doubler ON Sleep Mode Current System 1 A ISleep *2 12 15 mA IoHPWM PWM Output Drive Current PWMP, PWMN VDD=3V; Voh=2V *2 33 40 mA IoLPWM PWM Output Sink Current PWMP, PWMN VDD=3V; VoL=1V mA VO, DAO VDD=3V;VO=0~2V,Data=7F 2.5 3 IoVO DAC Output Current 0.8 V Input High Voltage I/O pins ViH VDD 0.2 Input Low Voltage I/O pins V ViL VDD Threshold=2/3VDD(input from low to high) 1/3 Vhys Input Hysteresis Width I/O, RSTP_N V Threshold=1/3VDD(input VDD from high to low) *1 Output Drive Current I/O pull-high VoL=2.0V 50 A IoH I/O pull-low*1 VoL=0.4V 1.0 mA IoL_1 Output Sink Current ViL=GND, pull high RSTP_N 20 A IiL_1 Input Low Current Internally ViL=GND, if pull high I/O 100 A IiL_2 Input Low Current Internally by user Note: *1: Drive Current Spec. for Push-Pull I/O port only Sink Current Spec. for both Push-Pull and Open-Drain I/O port. *2: This Spec. base on one driver only. There are five build-in driver, so user just multiply the number of driver he used to one driver current to get the total amount of current. ( IoHPWMIoLPWM * N; N=0,1,2,3,4,5)
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KING BILLION ELECTRONICS CO., LTD
HE83138
HE80000 SERIES
H. Application Circuit
Twice Charge Pump is selected LCD Max. Voltage=LV3=3/2*VDD C6 LC1 LC2 Twice Charge Pump is selected LCD Max. Voltage=LV3=VDD VDD
0.1uF
LV3 LC1
LV1 Floating
C7 0.1uF
LV1
No Capacitor LC2
C9 0.1uF
LV3
No External Parts is necessary if user adopt Internal Fast RC Clock External Fast Clock: Crystal osc.
VDD FXI FXO RSTP_N SXI SXO PRTD[7:0] GND PRT17[7:0] COM[15:0] FXI FXO SXI FXO SXO 2MHZ FXI
VDD R1 50K
20P
BATTERY1
C1
C2
3V
20P
0.1uF 100uF
C3 0.1uF
SW1 RESET LC1 LC2 LV1
External Fast Clock: RC osc.
LC1
LCD PANEL
VDD
LC2 LV1
SEG[31:0] R > 8.2 KOhm FXI C: Please Ref. AN016
LV3 C1 0.1uF C2 0.1uF C3 0.1uF C4 0.1uF C5 0.1uF
LV3 < 9 Volt LR4 LR3
OPIN OPIP OPO DAO
1/5 BAIS CONFIGURATION
External Slow Clock: Crystal osc. Buzzer or Speaker Circuit
SXI VDD SP1 SXO 32.768K 20P 20P
PWMP LR2 LR1 LR0 VO LVG PWMN
?K Ohm
VR1
TSTP_P
Passive Bias & Q1 NPN Filter Circuit Please Refer AN022 for Speech Output Circuit
SPEAKER
External Slow Clock: RC osc.
SXI R: Please ref. AN016 SXO
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KING BILLION ELECTRONICS CO., LTD
HE83138
HE80000 SERIES
I. Important Note
1. Please always take in mind that ICE is different from IC which is your target body. ICE is the whole set of HE80000 series IC, but each IC is a subset of ICE. Never use any hardware resource that your target IC didn't have these resources, especially RAM and register. KBIDS and compiler cannot prevent user to use some hardware resources that don't exist in your target IC. Please check the following table and refer to the abbreviation in HE80000 user's manual.
I/O DTMF WDT Timer 16 -- T1,T2 LV2 LR LVG REC S.R. -- 4:0 Ext. I
I.F.C. E.S.C. I.P.R PROM DROM TP TP+1 RAM PP DP 48KB -- 16-bit 1KB 2-bit 8-bit VO DAO OP PWM LCD COM*SEG Bias Rgr ChrgPmp 512 16*32 1/5 -- 1,3/2
2.
LCD driving circuit must be turn off before IC goes into sleep mode.
3.
Please bonds the TSTP_P, RSTP_N and PRTD [7:0] with test points on PCB (can be soldered and probed) as you can, then some testing can be performed on PCB if necessary. The TSTP_P is suggested to connect to ground by a 0 ohm resistor. The following figure is an example (Testing point with through hole).
4.
J. Updated Record
Version Date Section Original Content New Content
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